2025 Speaker Highlights
C.S. Yoo, Ph.D
Vice President, Research & Development / More-than-Moore Technologies
Kam Lee
Senior Director, Deputy Head of TSMC Advanced Packaging Technology and Service
M. Ashkan Seyedi, Ph.D
Director, LinkX Products
Babak Sabi, Ph.D
VP of Technology
Marvin Liao, Ph.D.
Formerly VP Advanced Packaging and Technology Service of TSMC
Hamid Azimi, Ph.D.
Formerly CVP, Director of Substrate Packaging TD of Intel
2025 Venue
Grand HiLai Taipei
Venue Address:
NO. 168, JINGMAO 1ST RD., NANGANG DIST., TAIPEI CITY 115 , TAIWAN
Reservation Details:
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