Browave Corporation (3163, wwww.browave.com) is Engaged in the Development of Optical Communication Technology Leaders of the optical fiber communication industry with OEM/ODM development, production, and sales. Headquartered within the Science & Industrial Park of Hsinchu, Taiwan, Browave Corporation has been persisting in offering a large-scale service to world-class customers while earning much recognition since 1988.

With consistant efforts, our products are widely deployed in FTTH, Data Center, Cloud Computing, Digital Media, CATV, Broadband and, 5G applications. Customers chose Browave not only for the cutting-edge technique and manufacturing value we possess. but more for our in-time digital management ability.

Browave prides itself in the profound understanding of this new demand, committing itself to utilize the most and sophisticated All-Fiber and Micro-Optic technologies to provide our customers with a range of standardized products, in addition to offering products that cater to the special needs and specifications of our clients.

Chain Logic International Corp. (CLIC) was established in 1994, located in Hsinchu Taiwan, and our parent company is MPI Corporation/ www.mpi- corporation.com (IPO in 2003, TWSE: 6223)

CLIC is a professional agent in Taiwan, providing technical support and service for the manufacturing of high-tech industries such as Semiconductor, Optical devices, PCB, discrete devices, etc.

CLIC strives to continually deliver world-class service to our customers to assist them to optimize their production utilization.

Tel:+886-3-552 7788 Fax: +886-3-551 9899

E-mail: sales@cli.com.tw

Website: http://www.cli.com.tw/

DIS Tech is a business branch of Technoprobe S.p.A. aimed at strengthening company’s competencies in the PCBs and high-performance interfaces market consolidating the full vertical integration of its business model.

Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp.(OTC: 8027) has been delivering advanced laser and plasma solutions to the semiconductor industry for 30 years. Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, FCBGA, FCCSP, ABF micromachining, and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support. With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,and Europe, we provide swift support and continuous process optimization.

ficonTEC is the recognized market leader for automated assembly and test manufacturing systems for high-end opto-electronic components and integrated photonic devices. Considerable process capability and dedicated assembly technologies have been accumulated over 25 years of serving the needs of a broad selection of industry segments – including telecom/datacom, high-power diode laser assembly, IoT-conform sensor devices from bio-med to automotive lidar, micro-optical modules, fiber-optics and more.

More recently, ficonTEC’s flexible and scalable Industry 4.0 automation options are enabling new approaches to development and manufacturing, in particular for co-packaged-enabled optics in data center applications as well as in mainstream industrial sectors such as photonics for automotive.

Gigaphoton already has grown to dominate the Asian market including Japan with a large number of installed bases including most of major semiconductor device manufacturers in this region as the world’s leading excimer laser light source manufacturer. Gigaphoton also continues to enjoy rapid growth in the US and European markets.

Semiconductors have continued to evolve toward next-generation device technologies. Based on a global business strategy, we will strive to be the No. 1 lithography light source provider by focusing on market needs in every phase of our business, from research and development to manufacturing, sales, marketing and customer support.

Group Up Industrial Co. Ltd. (GP) began the business in 1990, we have the core belief of “Quality First, Service Foremost“, focusing on process technologies – “Coating,” “Drying,” and “Laminating.” Through automated integration, we have successfully enhanced the equipment capacity and precision to the semiconductor equipment industry.

Printed Circuit Boards (PCBs) lay the foundation for us, keeping pace with global trends, we are a leading global supplier of equipment for Flexible Printed Circuits (FPCs) and IC substrates, maintaining a high market share worldwide.

Building on our solid industry experience, GP has expanded into FO PLP and TGV, glass core substrate market, continuously innovating with the times.

HON.PRECISION,INC.(HPI) was founded by a group of engineering R&D personnel with a passion and vision for excellence, innovation and semiconductor automation equipment. We come from different cultures, backgrounds and experiences, but we share a common goal: to become the leader in the IC semiconductor automation equipment industry.

We are committed to providing the highest quality automated test sorting machines and related visual AOI/AI computing processing, normal/high/low temperature temperature control,down force, bar code, network, communication, and database to IC semiconductor customers around the world.production data central monitoring system, AGV… and other complete automated integrated solutions. With unremitting efforts and quality improvement and persistence, we have established close partnerships with major semiconductor customers around the world.

REMAIN UNCHANGED WITH A REMINISCENT MIND ALONG THE JOURNEY

From the R&D and production factory in Taiwan to the investment and establishment of subsidiaries in China and the United States, we cooperate with agent partners in various regions around the world to provide customer support and services nearby, and have won the Yushan Award for Best Supplier and Brand from many customers. With honors and testimony such as the Rock Award, HON.PRECISION,INC. is honored to participate in and witness the rapid development of semiconductor technology in human history. We will continue to research and develop, continue to work hard, and grow together with world-class semiconductor customers!

Manz Asia specializes in innovative production solutions for advanced panel-level packaging. We provide a comprehensive range of manufacturing systems, from customized machines for lab and pilot production to standardized modules and turnkey lines for mass production. Manz’s solutions deliver superior resource efficiency, increased throughput, and faster time-to-market, empowering customers to boost productivity and competitiveness.

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in the testing of Semiconductors, Light Emitting Diodes (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components, and more. MPI’s five main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test, Thermal Test, and Celadon Systems.

MPI offers a wide-ranging portfolio of products and services, from advanced probe card technologies, mass production and engineering probe systems, testers, material handlers, inspection systems, and thermal air stream systems. MPI’s diverse product portfolio and expertise in leading edge technologies creates a healthy environment for employee growth and retention. With the cross-pollination of technologies and talent, we are committed to delivering long-term value to enhance the competitiveness of our customers.

MPI is the first Taipei Exchange (TPEx) listed probe card company in Taiwan.

Nano Electronics and Micro System Technologies, Inc., founded in 2002, is a leader in plasma technology innovation, providing high-performance surface treatment solutions across industries including semiconductors, PCBs, and optoelectronics. With a strong R&D team, we’ve secured multiple patents in high-density vacuum and atmospheric plasma technologies, serving markets in Taiwan, China, Japan, U.S., Europe and other parts of Asia.

Our core strengths lie in continuous innovation and excellence, extending beyond electronics to consumer industries and biomedicine. We value integrity, cooperation, and a ‘family culture’ that nurtures employee growth and fosters a sense of belonging.

Committed to continuous improvement, we strive for excellence in every aspect of our operations. Looking ahead, we aim to lead in technology while contributing to societal and economic advancement through our innovative products and global partnerships.

Founded in 1918, Nitto has developed our business globally to offer various products in fields such as electronics, automobiles, housing, infrastructure, environment, and medicine. The Nitto Group strives to become a centennial company that is always trusted by customers, embraced by employees with pride, makes an active contribution to society, and continuously grows on a global scale with our slogan, “Innovation for Customers.”

Scrona is an innovative company that is revolutionizing the world of electrostatic multi-nozzle printing technology. Our MEMS-based printing engine enables ultra-high-resolution printing on a scalable platform. Here are some highlights:

• Resolution: Scrona’s printing technology offers 100 times better resolution than conventional inkjet printers. Even tiny details are reproduced with razor-sharp clarity.
• Material Versatility: Scrona’s print heads can handle not only thin inks but also materials that are 100 times more viscous.
• 3D Printing: Scrona enables stackable 3D printing with a high aspect ratio of over 10:1 and nanometer-scale layer thickness.
• World Record: Scrona holds the world record for the smallest color photo ever printed. This image fits within the cross-section of a human hair.

Scrona has the potential to redefine semiconductor and display production and shape the future of microfabrication. Our MEMS chips are the heart of our technology, offering sub-micrometer-precise printing on nearly any material.

We are Siliconphotonics advanced package and testing solution provider. Suruga Seiki is a Japanese company founded in 1964. Taiwan is the APAC operation center with design and CPO system assembly functions.

We are focusing on Siliconphotonics, Photonics wafer restring, PIC functional test and Active alignment, passive alignment, edge coupling and grating coupling by our key components, module, and tester system.

We can also provide camera module and lens decenter alignment inspection with our laser collimator and high precision stage.

Our website:
[About Siliconphotonics, Advanced Testing&Package functions for PIC]

[About Company Profile]

High-Speed Patterned Metallization for Advanced Packaging. Syenta introduces Localized Electrochemical Modelling (LEM) direct patterning & deposition in a single process. Small features patterned at high-throughput with very high coplanarity.

Established in 1992, Utechzone has been devoted to the research and development of AOI (Automatic Optic Inspection) machines for more than three decades. Utechzone not only launches a complete product line covering the PCB, Semi, COF, and LCD/LCM industries but also presents AI deep learning to further enhance precision and efficiency.

With the core competence of ”We serve with vision”, Utechzone has integrated optics, software, mechanisms, electricity control, and algorithms to assist various manufacturers in achieving high quality at a reasonable cost. Utechzone, the worldwide AOI leader, will be your best quality guardian.

YAYATECH began with a successful collaboration with a Germany’s partner from 2008 to 2014 together, we engineered advanced inspection machines for solar wafers and cells. This international experience was instrumental in our evolution into the semiconductor advance packaging.
Our portfolio now includes state-of-the-art using Infrared (IR) inspection machines for wafer cracks or chipping, Reel IC cracks or chipping, and substrate ICs.
These innovations have garnered recognition from leading packaging companies. With a focus on precision and next-generation packaging requirements, our R&D team is also integrating AI technology to deliver comprehensive inspection solutions.