27-28 August 2025
Suwon
27-28 August 2025 - Suwon
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
When your expedited shipment needs to reach its destination fast, we do whatever it takes to make it happen. We are more than an international courier, we are your partner in emergency logistics. We understand your challenges and work tirelessly to find the perfect solution for every urgent shipment. Delivering customized, reliable, and efficient NFO and hand-carry solutions for time and mission-critical shipments from anywhere to everywhere in the world. CNW is a major supplier in the Semiconductor and Automotive Industry. In an aircraft on ground situation, getting the plane back in the air is priority #1. With global 48 offices worldwide, plus an arsenal of loyal local logistics partners, CNW is ready to take on your logistic challenges.
General email: info@cnwglobal.com
Phone number:
+1.800.852.2282
+1.718.656.7777
NFO
Our Next Flight Out service is what we’re known for. CNW’s longstanding relationships with airlines, paired with our unwavering determination and creative mindset, allow us to get your package to its destination on the fastest route possible – at a substantial cost savings.
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
OBC
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
Our On-Board Courier (OBC) service is secure, reliable, and gives your package that extra special care. All CNW couriers are highly trained and will transport your goods using only the best practices. Moving your shipment via On-Board Courier is as easy as making a phone call. Whenever you need us, we’re here.
ACF
Occasionally, there are extreme situations when the only way to get your package to its destination on time is with an air charter. When that happens, CNW has got you covered. We can charter an aircraft dedicated solely to your shipment – large or small – to guarantee on time delivery of any package.
Core Insight is a leading company for EOS/ESD control with technical expertise and key insights for Advanced Package Device application. Heterogeneous Integration technology revolutionary achieved new device era. This new technology also brought new challenges that much less ESD sensitivity before it finished package device. Core Insight has prepared to meet new level of ESD control with world best ionization solution which no one else have. Core Insight has understanding device technology, manufacturing process and ESD control know-how for Advanced Package Device handling.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
The KOKUSAI ELECTRIC Group is a specialty manufacturer of semiconductor manufacturing equipment that plays a key role of cutting-edge technology of the semiconductor evolution.
We specialize in the indispensable thin film deposition, and treatment in which to improve the thin film quality of the semiconductor device manufacturing process, expanding our business that has garnered immense praise by the customers from all around the world.
Based on our corporate slogan “Technology & Tai-wa for Tomorrow”, we will pursue economic, environmental, and social values from both business and ESG (resolving environmental and social issues and strengthening governance) aspects, with the aim of contributing to the achievement of SDGs and realizing a sustainable society and our group’s sustainable development.
“SIMPLE PERFECTION”
At the core of our values is “Simple Perfection.” Since our founding in 2000, we have adhered to the belief that no task is too difficult or complex. Our mission is to turn every challenge into a simple, flawless solution. This unwavering commitment drives us to continually evaluate and improve every aspect of our work. It encourages our team to think innovatively, aim higher, and dream of a future full of boundless opportunities.
“THE FIRST”
We are firm believers that true innovation comes from leading the way, not following in others’ footsteps. To make a meaningful impact on the future, we must be at the forefront. Our advanced technologies are crafted to deliver unmatched value to both our customers and our company. This vision goes beyond a simple goal—it is a profound mission we hold close to our hearts. We are fully committed to this journey and inspire every member of our team to contribute to realizing this extraordinary vision.
We have been dedicated to providing innovative wafer prober technologies for over 20 years, continuously expanding our product offerings to cover all areas of wafer testing, including BURN-IN, CP, and TESTER.
Our flagship products include OPERA, a multi-prober solution, and OSTINATO, a multi-wafer burn-in system, both designed to meet the highest industry standards and offer unparalleled performance for all your wafer testing needs.
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
USIC created the test grade silicon wafer business when it was founded in 2017. In 2024, USIC served 30+ customers and provided 36 products for various segments covering a variety of end markets including IC foundry, semiconductor equipment and OSAT segments.
USIC’s innovative refreshed technologies is a new breakthrough in silicon wafer industry. Refreshed Technology is a cost-effective choice for customers who prioritize efficiency and affordability in their operations.
USIC’s refreshed technology achieves a zero-carbon footprint manufacturing process aligned with ESG requisites. This starkly contrasts with traditional crystal growth practices that are energy intensive, making it exemplify an environmental consciousness vital in the current business landscape.
Yamaha Robotics Holdings Co., Ltd. was established in July 2019 as a holding company, with Yamaha Motor Co., Ltd. as the parent company and three operating subsidiaries: SHINKAWA LTD, APIC YAMADA CORPORATION, and PFA Corporation.We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds,surface mounters, Industrial Robots, and various automated equipments.
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
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