ERS electronic GmbH has gained an outstanding reputation in the industry, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.

Leveraging its decades of thermal management experience, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Wafer- and Panel-level Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Advanced Packaging space, by supporting different wafer formats and panels. The company’s most recent innovations include the Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute. In 2024, ERS also introduced its series of semi-automatic and fully-automatic PhotoThermal debonding machines, offering a breakthrough solution for TBDB processes. This innovative method minimizes operational costs while ensuring high throughput and exceptional process flexibility, regardless of adhesive material type or supplier. By lowering operational costs by more than 30% compared to laser debonding and enhancing efficiency, this technology is well-suited for applications involving AI chips, power ICs, GPUs, and high-bandwidth memory (HBM).