2025 ISES Sponsors Profiles

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2025 ISES Sponsors

Plasma-Therm

Established in 1974, Plasma-Therm is a global manufacturer of advanced plasma processing equipment, providing tailored solutions to the specialty semiconductor markets, including wireless, power devices, photonics, sensors, and MEMS, advanced packaging, memory, and R&D. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base.

www.plasmatherm.com

Phone: +1 727-577-4999 or information@plasmatherm.com

Products & Services

Plasma-Therm’s product portfolio includes single wafer, batch, and cluster solutions for Etch (ICP, RIE, DSE, IBE, ALE); Deposition (PECVD, HDPCVD, F.A.S.T); Material Modification (HDRF, RTP); and Die Singulation Applications (PPDOT). Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of our global customer base.

Okmetic Oy

Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.

Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.

Products & Services

Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.

Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.

AP&S International GmbH

For over 20 years, we have been supplying high-performance wet process equipment for the surface treatment of wafers to the world’s leading semiconductor manufacturers. Our modular product range is perfectly tailored to the needs of the semiconductor industry, whether standard wet process equipment or a customized solution is required.
Chemical wet processes are our passion. As a leading supplier for the semiconductor, MEMS and microelectronics industry, we offer wet process equipment for batch and single wafer processes as well as process supporting equipment!

Far-sighted, customer-oriented, innovative and committed to continuous progress – this is AP&S and its wet process equipment. At home in the semiconductor industry worldwide, we help shape the future of semiconductor production!

Products & Services

Efficient wet process solutions for your semiconductor production. Whether you need a standard system or a customized wet process solution: Our modular product range is perfectly tailored to your needs!

AP&S offers the complete range of wet process equipment from single wafer systems to wet benches for batch processes as well as fab logistics equipment.

The AP&S product range includes manual, semi-automatic and fully automatic wet process solutions for the semiconductor, MEMS and microstructuring industries as well as for the R&D sector. Among others, AP&S equipment covers the following wet processes: cleaning, etching, metal etching, PR stripping, electroless metal deposition, lift-off process, drying, developing and others.

We offer wet process equipment for batch processes as well as for single wafer processing and equipment for ensuring cleanliness and maximum productivity in semiconductor production such as FOUP, SMIF and box cleaners as well as various chemical management systems. AP&S equipment is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.

Pentamaster Technology

Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.

With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.

ASMPT Limited

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

Soitec

Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.

In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.

With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.

Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.

For more information visit: www.soitec.com.

Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions.

FormFactor

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.

FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.

Visit www.formfactor.com or follow us on LinkedIn.

ULVAC Technologies, Inc.

ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.

ULVAC is the global leader for thin film PZT deposition and etch.

ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany

Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu

Products & Services

For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.

Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.

Nordson TEST & INSPECTION

Nordson Test & Inspection offers its SMT & Semiconductor customers a robust product portfolio, including Acoustic, Optical and both Manual and Automated X-ray Inspection systems, X-ray Component Counting systems and Semiconductor measurement sensors. Nordson Test & Inspection is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.

About Nordson

Nordson Corporation (Nasdaq: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at https://www.nordson.com/, https://x.com/nordson_corp or https://www.facebook.com/nordson/.

Products & Services

Advanced Metrology & Inspection

High Accuracy. High Resolution. High Speed.

Nordson Test & Inspection manufactures world-class metrology and inspection systems & sensors. Our inspection metrology equipment meets the highest standards for electronic assembly and semiconductor applications. Acoustic, Optical, Bond Test, X-ray Components, Manual X-ray, and Automated X-ray systems enable you to identify even the smallest defects at high resolution and capture critical measurements. Wireless Semiconductor Sensors can significantly improve semiconductor tool setup and maintenance.

We design, develop, and manufacture innovative inspection & metrology equipment for a wide range of industries, including AI, Server & 5G, Consumer, Automotive, Power & Energy, Sensors & LED, Aerospace & Defense and Medical.

Our key segments include Advanced SMT, Advanced Packaging, Front-End semiconductor, Mid-End semiconductor, and Back-End semiconductor.

The right inspection & metrology equipment can elevate your product quality. If you’re looking to save time and money, and improve your yields, processes, and productivity, of the semiconductors or the electronics you manufacture, our inspection equipment can help you ensure exceptional quality every time.

KLA

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com

ERS electronic GmbH

ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales, demo centers and support offices in the US, China and Taiwan.

Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com

Products & Services

ERS electronic GmbH has gained an outstanding reputation in the industry, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.

Leveraging its decades of thermal management experience, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Wafer- and Panel-level Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Advanced Packaging space, by supporting different wafer formats and panels. The company’s most recent innovations include the Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute. In 2024, ERS also introduced its series of semi-automatic and fully-automatic PhotoThermal debonding machines, offering a breakthrough solution for TBDB processes. This innovative method minimizes operational costs while ensuring high throughput and exceptional process flexibility, regardless of adhesive material type or supplier. By lowering operational costs by more than 30% compared to laser debonding and enhancing efficiency, this technology is well-suited for applications involving AI chips, power ICs, GPUs, and high-bandwidth memory (HBM).

Resonac Corporation

Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.

We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.

TRUMPF Huettinger

通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。

2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。

TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.

The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.

Products & Services

Product introduction:
1. TruPlasma DC 4000 (G2) Series

TruPlasma DC 4000 (G2) 系列专为金属，金属氧化物，绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出，在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.

2. TruPlasma DC 3000 (G2) Series

TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺，得益于先进的电弧管理和集成水冷装置，该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外，极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.

3. TruPlasma RF 1000/3000 (G2/13) Series

全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列，对工艺过程中的所有参数进行实时监测，即使在要求严苛的等离子体工艺中，仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时，实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.

4. TruPlasma LF Series

TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k，400k，2M，功率范围1~10kw，适用于各类半导体，光伏，ALD，刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.

5. TruPlasma VHF 3000 series

TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M；40M；60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.

Onto Innovation

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

SPEA

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

Products & Services

SPEA product portfolio includes test equipment for:
Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.

mks | Atotech

Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com

Evatec

Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

Airspace

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

Products & Services

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.

From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.

Your supply chain is complicated — we make it easy for you.

Lam Research Corporation

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com

Products & Services

We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.

Amkor Technology, Inc.

Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com

Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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