Vincent Dicaprio
Biography
Vincent has accumulated over 35 years of experience in Technology Development, Operations, Business, Sales, and Marketing, demonstrating success at renowned companies such as IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES. He joined Applied Materials in 2016.
Currently leading Technology Pathfinding, Corporate, and Business Development within the Advanced Packaging and ICAPS division at Applied Materials, Vincent is responsible for establishing strategic alliances and partnerships essential to advancing technology for future product solutions. He oversees all aspects of critical technology transitions pertaining to Heterogeneous Integration, next-generation silicon integration, and volumetric scaling associated with advanced packaging technologies, including 3DIC Heterogeneous Integration.
In addition, Vincent serves on the Advisory Board of BESI, a company that specializes in advanced packaging equipment, International Semiconductor Industry Group and holds the position of Vice-Chairman at iNEMI, a consortium dedicated to the global electronics manufacturing supply chain.
Vincent holds a degree in Pure and Applied Sciences from Champlain Regional College and a Bachelor of Engineering degree from Concordia University. He is the author and co-author of over 40 patents in the field of advanced semiconductor packaging and heterogeneous integration.
Company Profile
Applied Materials
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.