Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Amy Leong
CEO
Amy has 26+ years of semiconductor experience in P&L management, product development, global sales and marketing, mergers and acquisitions. Prior to joining AEM, she held various senior leadership positions in California US with FormFactor, including Chief Commercial Officer, General Manager, and Chief Marketing Officer. Amy has been serving as an advisory board member of International Semiconductor Executive Summits (ISES) since 2016, and Singapore Semiconductor Industry Association (SSIA) since 2024.
Amy received a Master of Science degree in materials science and engineering from Stanford University and a Bachelor of Science degree in chemical engineering from the University of California at Berkeley.
Company Profile
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets. Our mission is to provide the most comprehensive semiconductor and electronics test solutions based on the best-in-class technologies, processes, and customer support.
AEM is the pioneer of massively parallel, fully automated test solutions. Our expertise has been developed over the past two decades where AEM now has the largest fleet of such high parallel systems in the world serving the advanced performance compute market.
AEM has a global presence across Asia, Europe, and the Americas, with R&D centers located in Singapore, Malaysia, France, Finland and the US. AEM has manufacturing plants in Singapore, Malaysia (Penang), Indonesia (Batam), Vietnam (Ho Chi Minh City), and Finland (Lieto), and a global network of field engineering support and sales offices.
AEM: Unleashing the Power of Tomorrow – Leader in High-Performance Processor Testing for the AI Era
AEM is a global leader in intelligent system test and handling solutions for semiconductor and electronics companies serving the advanced computing, 5G, and AI markets.
AEM’s technology pillars stem from the substantial investments made in R&D to sustain our leadership in three critical verticals: Industry leading Active Thermal Control, Advanced Factory Automation, and Application-Optimized Test Instrumentation.
AEM’s Solutions:
Industry Leading Active Thermal Control: Common active thermal collaterals integrated into various test insertion solutions ranging from the engineering lab to high volume manufacturing to enable rapid time to market and yield improvements.
Advanced Factory Automation: Factory 4.0 automation for low to massively parallel test insertions optimized for maximum throughput and lowest cost of test.
Test Instrumentation: Highly optimized test instrumentation, coupled with active thermal control and automation, that challenges the current cost-prohibitive traditional ATE test methodology.
Deepak Kulkarni
Senior Fellow Advanced Packaging
Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Curtis Zwenger
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He was formerly responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Company Profile
Vincent Dicaprio
Vice President – Head of Business and Corporate Development and Technology Pathfinding, Advanced Packaging and ICAPS
Vincent has accumulated over 35 years of experience in Technology Development, Operations, Business, Sales, and Marketing, demonstrating success at renowned companies such as IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES. He joined Applied Materials in 2016.
Currently leading Technology Pathfinding, Corporate, and Business Development within the Advanced Packaging and ICAPS division at Applied Materials, Vincent is responsible for establishing strategic alliances and partnerships essential to advancing technology for future product solutions. He oversees all aspects of critical technology transitions pertaining to Heterogeneous Integration, next-generation silicon integration, and volumetric scaling associated with advanced packaging technologies, including 3DIC Heterogeneous Integration.
In addition, Vincent serves on the Advisory Board of BESI, a company that specializes in advanced packaging equipment, International Semiconductor Industry Group and holds the position of Vice-Chairman at iNEMI, a consortium dedicated to the global electronics manufacturing supply chain.
Vincent holds a degree in Pure and Applied Sciences from Champlain Regional College and a Bachelor of Engineering degree from Concordia University. He is the author and co-author of over 40 patents in the field of advanced semiconductor packaging and heterogeneous integration.
Company Profile
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
Martin Weigert
VP & GM Industrial Fiber Products Division
Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber optic and sensor products targeting the industrial, automotive and medical market. Martin Weigert worked for Siemens/Osram/Infineon/Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Broadcom. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies GmbH in Munich, Avago Technologies Fiber Austria GmbH in Vienna and a member of the supervisory board at CISES (Chinese International Semiconductor Executive Summit).
20 years experience in Fiber Optics
1994 -1997 – Process development MEMS
1997 -1998 – Task force leader production ramp-up
1998 –1999 – Project leader optical SMD devices
1999 –2000 – Marketing Manager Automotive LED
2001 –2004 – Director Development Fiber Optics
2004 –2006 – Director Marketing POF
2006 –2007 – Director Product Line Manager (R&D+Marketing) at Infineon
Since 2008 – General Manager Industrial Fiber Optics at Avago Technologies
Since 2009 – Managing Director “Avago Technologies Fiber GmbH”
2011-2017 – Member of the supervisory board at MIC AG
Since 2012 – Managing Director “Avago Technologies Fiber Austria GmbH”
2014-2016 – Vice President & General Manager at Avago Technologies
Since 2016 – Vice President & General Manager at Broadcom
Company Profile
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
Najwa Khazal
Chief Operating Officer
Najwa Khazal is the Chief Operating Officer for Busch Group USA and a global business leader with 20+ years of experience across America, China, EMEA, India, and Mexico. She specializes in supply chain management, program management, and digital transformation for $3B organizations in industries such as aerospace, automotive, energy, medical, and more. Najwa excels in leading complex, multimillion-dollar projects from concept to commercialization, while driving cost optimization and sustainable performance. A passionate educator with 12+ years of teaching international business, she is trilingual and recognized for her exceptional leadership, strategic execution, and commitment to operational excellence across global markets.
Company Profile
Pfeiffer Vacuum+Fab Solutions delivers best-in-class vacuum and semiconductor fabrication solutions for a wide range of industries, including semiconductor manufacturing, analytics, research, and other high-tech applications. We combine advanced vacuum technologies, such as pumps, leak detection systems, and measurement instruments, with specialized fab solutions to support critical processes with maximum precision and reliability.
As part of the Busch Group, one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors, and gas abatement systems, we have access to a global network of expertise and innovation. The Busch Group brings together three industry-leading brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions, and centrotherm clean solutions.
With over 8,000 employees in 44 countries, the Busch Group is committed to delivering superior service and cutting-edge technologies worldwide. The group operates 23 production plants across key regions, including China, Germany, the USA, Vietnam, and others, ensuring global reach with local support.
Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave has served as Chief Commercial Officer since 2024 at FormFactor. Aasutosh has more than 20 years of experience in semiconductors with a focus on developing global field teams, as well as business revenue growth and customer management. Prior to joining FormFactor, Aasutosh held various leadership and management positions at ASML. Most recently, he served as the Head of Global Sales and Applications leading their eBeam business. Aasutosh has held positions from R&D process engineer, Product Marketing, Product Development, and Sales at Hybond, AMD and Mentor Graphics (now Siemens).
Aasutosh received his M.S. in Electrical Engineering from The University of Texas at Arlington and his B.E. from Gujarat University in India.
LinkedIn Profile: https://www.linkedin.com/in/aasutosh-dave-646a11/
Company Profile
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Oreste Donzella serves as Executive Vice President and Chief Strategy Officer at KLA Corporation, leading key corporate growth initiatives and working closely with external stakeholders, such as financial investors and end customers in the broad electronics ecosystem.
Prior to his current role, Oreste was Executive Vice President, managing the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which included multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.
Previously, Oreste was the Chief Marketing Officer (CMO) of KLA. In this role, he oversaw corporate marketing activities, market analytics and forecast, and companywide collaborations with the broad electronics industry.
In the years before his CMO role, Oreste led the world-wide field applications engineering team, and was responsible for Customer Engagement projects and product portfolio optimization for wafer inspection platforms at KLA.
Previously, Oreste was Vice President and General Manager of the Surfscan and SWIFT divisions at KLA-Tencor. In these positions, he was responsible for the unpatterned wafer inspection, wafer geometry, and macro inspection business, overseeing new products development, sales, and marketing activities, customer support, and ultimately, division financial performance (P&L).
Oreste brings 30+ years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent almost seven years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.
Oreste holds various patents and is featured in several technical publications.
In 2020, Oreste was awarded with VLSI Semiconductor All Star for “charting KLA’s path into new markets related to More than Moore semiconductor technologies”
Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy .
Company Profile
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Thy Tran
Vice President of Global Front End Procurement
Thy Tran, VP of Global Front End Procurement, joined Micron Technology in 2008, and has over 30 years of semiconductor experience in the US, Asia, and Europe. She held leadership roles in R&D, technology transfer and manufacturing for DRAM, SRAM and logic technologies, including two fab startups. In her previous role as VP of DRAM Process Integration, Ms. Tran led Micron’s global team in the US and Asia to drive DRAM technology development and transfer to manufacturing fabs. Prior to joining Micron, she worked in the at Motorola, Siemens, Infineon, Qimonda, and WaferTech. Ms. Tran is an alumnus of the University of Washington Electrical Engineering and Stanford Graduate School of Business Executive Program, and McKinsey Executive Leadership program. She is a recipient of the 2023 Global Semiconductor Alliance Women of Influence Award, a senior member of IEEE, and serves on several strategic advisory boards.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Mike Rosa, Ph.D.
CMO & SVP Strategy
Mike Rosa is chief marketing officer (CMO) and senior vice president responsible for strategy at Onto Innovation. Prior to his current role, Mike served as CMO for Applied Materials ICAPS and Advanced Packaging Groups, where he was responsible for leadership of strategic and technical marketing, marketing communications, charting device segment inflection roadmaps and providing strategic business development support toward M&A activities. He has over 25 years’ experience in semiconductor engineering and technology, with roles that span device design and fabrication, equipment development, marketing and sales. His technical qualifications include B.Eng. (Hons) and Ph.D. degrees in Microelectronic Engineering and an MBA with dual majors in Marketing and Business Strategy. Mike has authored over 40 journal and conference publications and holds over 29 U.S. patents
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Robert Ferguson
President and CEO
Bob Ferguson is President and CEO of Schmid Systems Inc., part of the Schmid Group based Freudenstadt, Germany. He oversees US operations and drives growth for the company’s manufacturing solutions in the Electronics, Photovoltaics, Energy Systems and Customer Service markets.
A seasoned executive with a distinguished 30-year track record in the specialty chemicals and electronic materials sectors, Bob’s combined corporate and consulting expertise includes strategic planning, sales and marketing excellence, M&A due diligence and integration, Asia sourcing strategies and human capital.
Bob previously served as Executive Vice President Electronic Materials & Asia, Avantor Performance Materials where led the turn-around of the semiconductor business. Prior to this appointment and China-based, he was Corporate Vice President, Asia Development at Veeco Instruments and Corporate Vice President, Electronic Materials, and Global Business Unit Director at Dow Chemicals.
Bob is a prior Board Member and former Chair for IPC International (www.ipc.org), an electronics standards and trade association, as well as the founder of boutique consultancy, BreakFree Strategies. Additionally, he served as a Board Member and Chair of Nichigo Morton, a Japanese based joint venture between Rohm and Haas (now Dow Chemicals) and Nippon Gosai.
Company Profile
The SCHMID Group is a world-leading global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, with its parent company Gebr. SCHMID GmbH is based in Freudenstadt, Germany. Founded in 1864, today it employs more than 800 staff members worldwide, and has technology centers and manufacturing sites in multiple locations including Germany and China, in addition to several sales and service locations globally. The Group focuses on developing customized equipment and process solutions for multiple industries including electronics, renewables, and energy storage. Our system and process solutions for the manufacture of substrates, printed circuit boards and other electrical components ensure highest level of technology, high yields with low production costs, high efficiency, quality, and sustainability in green production processes. www.schmid-group.com
Jason Zee
Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director
Jason Zee is an experienced Group General Manager with a demonstrated history of working in the semiconductors and robotic automation industry. He has over 30+ years of experience in the Semiconductor Test industry. In his 30+ years in the business, he has served in a variety of roles in product management, marketing, engineering, senior management in multiple countries and managing multi-million P&L businesses. His current role is the Vice President and General Manager of the Storage and System Level Test Group at Teradyne. Mr. Zee is also fluent in multiple languages including English, Mandarin and Cantonese that serves him well in this global business.
Mr. Zee earned a Bachelor’s degree in Electrical Engineering from Worcester Polytechnic Institute in Worcester, Massachusetts and his Master’s Degree in Engineering from Cornell University in Ithaca, New York.
Company Profile
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
Geoffrey Stoddart
Senior Vice President Global Business Development
Company Profile
WGNSTAR, formerly Westerwood Global and NSTAR Global Services, and as of June ’24 WGNSTAR acquired Principle Service Solutions (PSS), provide innovative and cost-efficient managed workforce services and asset lifecycle management solutions. We partner with our clients to:
- Build a custom approach that is tailored to specific operations and ultimate business goals
- Provide managed workforce and flexible staffing solutions to solve workforce challenges
- Assist with asset lifecycle management to maximize the value of your equipment
With regional offices throughout the United States and Ireland, we are strategically located where our clients need us most. Visit us at: www.wgnstar.com
Jennifer Zhao
CEO Global Business, SIngapore
Jennifer Zhao formerly EVP and GM for Advanced Optical Sensors Division of ams OSRAM. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Formerly Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater China and South East Asia.
Company Profile
GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 with branch offices in many countries and regions worldwide, providing local support at customers’ fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and power as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice management system has achieved ISO 9001 and ISO 14001 certification. Constantly looking to expand the technology offering to customers, GigaDevice has also formed multiple strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com
Hamid Azimi, Ph.D.
Chairman of the Board
Formerly CVP of Intel
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Ralph Zoberbier
CMO
After completing his first degree in applied sciences, Ralph completed his MBA in 2006 and gained over 20 years experience in the semiconductor equipment business across roles in engineering, product management and global business & sales management. He joining Evatec in 2019 as Head of BU Advanced Packaging leveraging his expertise across thin film technology, lithography and plating. At the end of 2023 he became Evatec CMO responsible for the team at Evatec headquarters driving business across all Evatec markets including packaging , semiconductor, optoelectronics and photonics. Today he also leads its global sales and service teams.
Company Profile
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Thomas Stenger
Senior Vice President, Head of Business Line Functional Materials
Thomas Stenger is Senior Vice President, heading the Functional Materials Business Line at Heraeus Precious Metals. He holds a Master’s degree in Industrial Engineering and has 20 years of experience in the precious metals industry. He served in various roles, always dedicated to enhancing Heraeus’ materials business across diverse sectors such as Automotive, Medical, PV, or Semiconductor. Thomas is dedicated to driving innovation and developing material solutions that empower industries to achieve the next technological advancements.
Company Profile
Heraeus Precious Metals is globally leading in the precious metals industry. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to refining and recycling. It has extensive expertise in all platinum group metals as well as gold and silver. With more than 3,000 employees at 17 sites worldwide, Heraeus Precious Metals offers a broad portfolio of products that are essential for many industries such as the automotive, chemicals, semiconductor, pharmaceutical, hydrogen and jewelry industry.
Heraeus offers top-quality solutions and products based on many years of experience and technical expertise. They are a reliable development partner for customers and find the best solutions for their requirements. One area for precious metals in semiconductors is the use of special alloys for semiconductor wafer testing, also known as probing. Heraeus offers a wide range of probe pin materials, from precipitation-hardened PdAgCu alloys to high-strength PtNi alloys. Probe pin materials made by Heraeus can be applied to any probe card type.
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar is the Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.
Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.
A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.
Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.
Company Profile
Natcast is a purpose-built, non-profit entity designated to operate the National Semiconductor Technology Center (NSTC) by the Department of Commerce. Established by the bipartisan CHIPS and Science Act of the U.S. government, the NSTC is a public-private consortium with a mission to advance U.S.-led semiconductor research and innovation, foster a skilled workforce, and strengthen America’s economic and national security.
Habib Hichri, Ph.D.
EVP, Senior Fellow, Global Applications and Business Development
Education:
- PhD in Chemical Engineering
- MBA
Experience:
- Executive Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
- Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation.
Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication. Habib holds over 36 U.S. patents and authored over 75 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley – IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is the chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS). He was the general chair of IMPAS 2020. Habib is a fellow of IMAPS Society. He is currently member of the IMAPS executive council. Habib is member of iNEMI board since April 2024.
Company Profile
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
- Insulation film: Ajinomoto Build-up Film (ABF)
- Magnetic materials (Film and Liquid Format)
- Semiconductor encapsulants (AEF )
- Adhesives & Encapsulants (PLANSET)
- Functional adhesive / encapsulation film “AFTINNOVA EF series”
- Latent curing agent “AJICURE”
- Pigment dispersants, coupling agents
- Flame retardants, polymer co-stabilizer
- Activated carbon
Please visit the website: Product information – Ajinomoto Fine-Techno Co.,Inc. (aft-website.com)
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